| 摘要 |
PROBLEM TO BE SOLVED: To reduce the thermal deformation and keep the plane state of a card formed at the time of hot pressing just as it is when the card is actually used by specifying the difference between the linear expansion coefficient of a plastic sheet composed of a center core and oversheets and the liner expansion coefficient of mold resin of an IC module. SOLUTION: An opening is formed on a center core 21 forming a central layer of a card base, and an IC module 10 is fitted into the opening, and oversheets 22 and 23 are laminated on the upper and lower faces of the center core 21 to manufacture a non-contact type IC card. At that time, it is required to set the difference of the linear expansion coefficient of mold resin of the IC module fixed into the opening of the center core and the linear expansion coefficient of a core sheet and plastic sheets used as oversheets to be laminated on the core sheet is set in the range of 20×10<-6> / deg.C. The recessed and projected shape of the module caused by the difference of linear expansion coefficients after molding is not demonstrated on the surface of a card by setting the above- referred difference of linear expansion coefficients. |
