| 摘要 |
PROBLEM TO BE SOLVED: To enable a semiconductor wafer to be diced along narrow dicing lines by a method wherein abrasive particles which contain fullerene particles are provided to edges provided to a rotary hub along is periphery. SOLUTION: A rotary dicing blade 20 is composed of a rotary hub 21 which is formed of Al alloy or the like, and provided with a hole 21a where the drive shaft of a drive device is inserted and a cutting edge 22 which is formed of nickel or nickel alloy and provided along the periphery of the rotary hub 21. A film 23 of nickel or nickel alloy which contains fullerene C 60 particles is formed on the surface of the cutting edge 22. The cutting edge 22 is typically 1.2mm or so in length and 60μm or so in edge width. Fullerene is an allotrope of carbon, and fullerene C 60 is composed of sixty carbon atoms which are mutually bonded together by covalent bonding alternately forming pentagons and hexagons, so that the C 60 has such a structure that it looks like a hollow reticulate soccer ball.
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