发明名称 Method of forming a resist pattern utilizing correlation between latent image height, resist pattern linewidth and surface modification layer width
摘要 A first correlation is obtained which is a correlation between latent image height produced after exposure on a resist layer, and resist pattern linewidth for a given length of develop time. Additionally, a second correlation is obtained which is a correlation between develop time for each exposure energy dose and resist pattern linewidth. The height of a latent image produced on an actually exposed resist layer is determined. From the first correlation, an estimated resist pattern linewidth, which is a resist pattern linewidth corresponding to a latent image height and to a given length of develop time, is found. From the second correlation, an estimated exposure energy dose, which is an exposure energy dose corresponding to a given length of develop time and to an estimated resist patten linewidth, is found. Additionally, also from the second correlation, develop time corresponding to a target resist pattern linewidth and to an estimated exposure energy dose is found, and according to the develop time found, a resist pattern is formed.
申请公布号 US5773174(A) 申请公布日期 1998.06.30
申请号 US19970890685 申请日期 1997.07.09
申请人 MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. 发明人 KOIZUMI, TAICHI;MATSUO, TAKAHIRO;ENDO, MASAYUKI
分类号 G03F7/038;G03F7/20;G03F7/26;G03F7/30;G03F7/38;(IPC1-7):G03C5/00 主分类号 G03F7/038
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