| 摘要 |
After forming a groove on one surface of a single-crystalline silicon layer, a silicon oxide layer is formed. Also, a polycrystalline silicon layer is formed on the silicon oxide layer to cover the groove. Subsequently, by a buffer layer of polycrystalline silicon is deposited over the polycrystalline silicon layer to form a smooth surface. Thereafter, a silicon oxide layer is formed on a separately prepared supporting substrate. After laminating both substrates by mating the buffer layer and the silicon oxide layer, annealing is performed. By this, voids which might otherwise be generated at the junction interface in the dielectric isolation substrate can be eliminated.
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