发明名称 POLYIMIDE HEAT-SENSITIVE RECORDING TRANSFER BODY
摘要 PROBLEM TO BE SOLVED: To provide elasticity modulus sufficient at the high temperature and keep long period heat resistance and chemical stability by using an aromatic polyimide laminate composed of two layers having specified elasticity modulus. SOLUTION: The elasticity of a polyimide film is 300kg/mm or more at the room temperature, and the elasticity modulus at 200 deg.C is 200 kg/mm or more. The thickness of the film is desirably 1-20μm, preferably 1-15μm or more, preferably 2-10μm. A heat-sensitive recording transfer body is formed by using the above-said polyimide film. The transfer body is constituted of a two-layer laminate, and although the two layers are desirably composed of the polyimide films of same molecular structure, they can be different. The surface roughness of the heat-sensitive transfer layer side (layer A) of the polyimide film is preferably 0.1μm or less, and the glossiness of the surface is preferably 70% or more. Also the surface roughness of the head layer side (layer B) is 0.12-1.00μm.
申请公布号 JPH10175380(A) 申请公布日期 1998.06.30
申请号 JP19960339698 申请日期 1996.12.19
申请人 MITSUI CHEM INC 发明人 YAMASHITA WATARU;NAKAJIMA JUN;KUWANO FUMIAKI;IKEDA YOSHI;TAMAI MASAJI
分类号 B41M5/382;B32B27/34;B41M5/40;B41M5/41;C08G73/10 主分类号 B41M5/382
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