发明名称 Method for making laminated integrated circuit devices
摘要 A method for producing laminated integrated circuit cubes includes applying conductive heat to the cube using at least one conductive heating device. A vacuum is created around the cube to remove air and other gases from between the integrated circuit layers prior to curing. A force is applied to the cube while it is heated under vacuum. A cooling gas is then circulated over the cube. Temperature and force sensing can be performed, and the process can be controlled by programmable logic controllers and the like.
申请公布号 US5772815(A) 申请公布日期 1998.06.30
申请号 US19960672398 申请日期 1996.05.29
申请人 INTERNATIONAL BUSINESS MACHINES CORPORATION 发明人 JORDAN, STANLEY ROBERT;STEWART, GARY LEON;TROLLINGER, RALPH
分类号 B29C43/56;H01L21/98;(IPC1-7):B32B31/00 主分类号 B29C43/56
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