WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME

摘要

PROBLEM TO BE SOLVED: To substantially decrease a specific resistance by constructing a conductive component of a conductive wiring layer form silver-coated copper particle of a specified diameter and applying high pressure to the particles to forcedly bond the particles together. SOLUTION: A conductive paste having silver-coated copper particles as the main ingredient applied by printing to the surface of an insulating layer including an organic resin to form a conductive wiring layer. Thereafter a pressure of over 50kg/cm<2> is applied to the conductive wiring layer to forcedly contact the silver-coated copper particles together. Thereby if the maximum diameter of contact traces 2 of the silver-coated copper particles 1 at a broken- out section of the conductive wiring layer is L and the diameter of the copper particles 1 is M, particles with L/M ratio of over 0.3 are over 70% of all particles having contact traces to decrease a specific resistance of the conductive wiring layer.