| 摘要 |
PROBLEM TO BE SOLVED: To improve reflow resistance property and thermal cycle property by using a thermosetting type that is made of epoxy resin and thermoplastic resin as an adhesive composition used for a board for connecting a semiconductor integrated circuit. SOLUTION: A board for connecting semiconductor integrated circuit includes at least one layer of each of a wiring substrate layer that consists of an insulator layer and a conductor pattern, a layer where no conductor pattern is formed, and an adhesive layer. Phenolnovolac-type epoxy resin or epoxy resin that is expressed by an equation is preferable as epoxy resin contained in the adhesive layer and R1-R10 in the expression indicates hydrogen atom, low-class alkyl group of C1-F4, or halogen atom. The epoxy resin is preferably blended by 20-60wt.% in the adhesive composition. A thermoplastic resin preferably has, for example, amino group, carboxyl group, epoxy group, hydroxyl group, and methylol group as a functional group that can react with the epoxy resin. |
