| 摘要 |
PROBLEM TO BE SOLVED: To improve reflow resistance property and thermal cycle property by using a thermosplastic resin and an epoxy resin that contains a specific epoxy risen as an essential constituent as an adhesive composition for a semiconductor integrated circuit. SOLUTION: Epoxy resin A that contains, as essential constituents, a thermoplastic resin and an epoxy resin (a) indicated by an expression is used as an adhesive composition for a semiconductor integrated circuit. R1-R8 in the expression indicate hydrogen atom, low-class alkyl group of C1-C4 or halogen atom. The epoxy resin (a) whose concrete example is terpenediphenoliglycidylether is contained in an epoxy resin A preferably by 60wt.% of higher and the epoxy resin A is contained in the adhesive composition preferably by 20-60wt.%. The thermoplastic resin preferably has, for example, amino group, carboxyl group, epoxy group, hydroxyl group, methylol group, isocyanate group, vinyl group, and silanol group as a functional group that can react with the epoxy resin A to improve heat resistance. |
