| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide an IC mounting multilayer printed wiring board which causes no breaking of wire resulting from cracking in an inner layer conductor wiring. SOLUTION: In an IC mounting multilayer printed wiring board constituted by laminating a plurality of resin substrates 12A, 12B, 12C, 12D and 12E, the thickness of plating layers 22 and 26 in a through hole 24 is 8-35μm, and the thickness of a conductor wiring 14e out of contact with an external lead pin 42 with the plating layers 22 and 26 in the through hole in between is 25-70μm. As a result, breaking of wire caused by cracking of the plating layers 22 and 26 in the through hole 24 and the conductor wiring 14e is prevented.</p> |
