Method for applying photoresist on wafer

摘要

A method for applying photoresist on a wafer is disclosed. The method comprises: lowering the temperature of the photoresist, and dispensing the photoresist on a portion of the wafer, where the wafer is supported by a spinner chuck and is rotated at a low speed. Thereafter, spreading the photoresist on the wafer by rotating the wafer at a high speed. Finally, planarizing the photoresist by rotating the wafer at a medium speed greater than or equal to the low speed in the dispensing step and less than or equal to the high speed in the spreading step.