发明名称 |
Removable heat sink assembly process for a chip package |
摘要 |
The process of the invention employs a post type fastening member that provides, at one end, an insertion friction connection to the circuit card and at the other end, extending through the heat sink, a compression spring means that urges the heat sink toward the cirduit card. A plurality of the post type fasteners are positioned around the periphery of the chip package to retain the heat sink parallel to the circuit card and compressing the chip package. The packaging structure of the invention permits larger area heat sinks than the chip package area to be supported by the circuit card with the only relationship with the chip being that of a compression thermal transfer contact and radiation shield.
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申请公布号 |
US5771559(A) |
申请公布日期 |
1998.06.30 |
申请号 |
US19960642251 |
申请日期 |
1996.05.02 |
申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
CIPOLLA, THOMAS MARIO;COTEUS, PAUL WILLIAM |
分类号 |
H01L23/367;H01L23/40;(IPC1-7):B23P11/02 |
主分类号 |
H01L23/367 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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