| 摘要 |
A package such as for an image sensing device includes the device, which preferably is a solid state image sensing device converting an optical image to an electric signal, metal bumpers formed on the bonding pads of the image sensing device, leads electrically connected to the bumpers, a dielectric wall hermetically sealing the connection areas of the leads and the bumpers, and surrounding the circumference of a light-receiving region of the image sensing device, a glass lid attached onto the dielectric wall and thereby sealing the light-receiving region, and a package body enclosing the structure except the top surface of the glass lid and an exterior portion of the leads. A method is disclosed which may have the following steps: (1) forming metallic bonding bumpers on bonding pads of an image sensing device, and disposing inner leads on the bonding bumpers and electrically connecting the inner leads to the bonding pads; (2) forming a dielectric wall that hermetically seals the connection areas of the leads and the bumpers in the circumference of a light-receiving region of the image sensing device; and (3) attaching a glass lid that transmits light onto the light receiving region within the dielectric wall, and molding a package body by using a molding compound.
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