| 摘要 |
PROBLEM TO BE SOLVED: To improve reflow resistance and thermal cycle property by forming an adhesive composition for forming an adhesive layer with an epoxy resin, a thermoplastic resin, and a thermosetting type adhesive containing aluminum hydroxide. SOLUTION: An adhesive layer 23 is composed of an epoxy resin, a thermoplastic resin, and a thermocuring type adhesive composition containing aluminum hydroxide. Any epoxy resin containing at least two epoxy groups in one molecule may be used. A copolymer with butadiene as an essential copolymerization constituent is preferable as a thermoplastic resin. Aluminum hydroxide is not especially limited in terms of a grain size and resin. Aluminum hydroxide is not especially limited in terms of a grain size and a shape but one of 1μm or less grain size is preferably used, and the amount of blend is preferably 2-40wt.% in the adhesive composition. A coating obtained by dissolving the adhesive composition in a solvent is applied onto a polyester film with a mold release property and is dried to obtain the adhesive layer 23. Then, a protection film 24 with a weak release force is laminated to obtain an adhesive sheet for semiconductor device. |
