发明名称 Isolation layer of semiconductor device and method for fabricating the same
摘要 An isolation layer structure of a semiconductor device includes a substrate; a first insulating layer having a predetermined width and thickness which is formed in a predetermined portion of the substrate; and a second insulating layer which is formed in a predetermined portion of the substrate and which surrounds the first insulating layer.
申请公布号 US5773351(A) 申请公布日期 1998.06.30
申请号 US19960740146 申请日期 1996.10.22
申请人 LG SEMICON CO., LTD. 发明人 CHOI, JONG MOON
分类号 H01L21/314;H01L21/76;H01L21/762;(IPC1-7):H01L21/76 主分类号 H01L21/314
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