In-situ technique for cleaving crystals

摘要

The specification describes techniques for cleaving crystal bodies, e.g. semiconductor laser bars, using thermostatic cleaving tools. Use of such tools allows the cleaving process to occur in an ultra high vacuum chamber without the use of mechanical devices activated from the exterior of the chamber. Cleaving occurs automatically and controllably by locally heating the cleaving tools, thereby deflecting the thermostatic element against the laser bar and causing fracture.