Anchor provisions to prevent mold delamination in an overmolded plastic array package

摘要

An overmolded plastic integrated circuit package which contains an integrated circuit that is mounted to a first surface of a printed circuit board. The integrated circuit is electrically coupled to a plurality of external contacts located on an opposite second surface of the printed circuit board. The integrated circuit is encapsulated and protected by a molded plastic compound. The printed circuit board has slots that receive a portion of the molded plastic material. The plastic filled slots anchor the outer encapsulant to the printed circuit board and prevent delamination between the interface of the circuit board and the adjacent encapsulant material.