| 摘要 |
PROBLEM TO BE SOLVED: To improve workability, adhesive strength, reliability and durability by a method wherein at least one or more kinds of resin and thermosetting resin, having a specific structure, are contained as the essential component of an adhesive material composition. SOLUTION: A semiconductor integrated circuit connecting board is provided at least with one or more layers of a wiring board layer, consisting of an insulative layer and a conductive pattern, and an adhesive layer consisting of a layer having no conductive pattern and an adhesive composition. It is indispensable that the adhesive composition contains at least one or more kinds of resin and thermosetting resin given by the formula. The X in the formula indicates either one of ester coupling, amide coupling, ether coupling, ketone coupling, sulfide coupling, urethane coupling, urea coupling and siloxane coup- ling. The R1 in the formula indicates a hydrocarbon group of 1 to 20C. R2 indicates the coupling of the carbon of α site of the main chain or a hydrocarbon of 1 to 3C. R3 indicates either of hydrogen atom or a methyl group. |
