| 摘要 |
PROBLEM TO BE SOLVED: To enable improvement in workability, adhesiveness, insulating reliability and durability, by incorporating respectively at least one type of thermoplastic rein and cyanate ester resin as essential components of an adhesive composition. SOLUTION: After aluminum hydroxide is mixed with a toluene/methylethyl ketone mixture solution, sand mill processing is carried out to prepare an aluminum hydroxide dispersion solution. NBR-C, bisphenol A cyanate ester resin, brominated epoxy resin, unbrominated epoxy resin, 2-methyl-4-methyl imidazole, manganese octylate, and methylethyl ketone of a weight equal to that of the dispersion solution are added at a predetermined composition ratio, thus preparing an adhesive solution. The adhesive solution is applied to and dried on a polyethylene terephthalate film with a silicon releasant. Meanwhile, a polyethylene terephthalate film with a silicone releasant of less peel strength is used to prepare an adhesive layer. Adhesive surfaces of these sheets are put together, thus providing an adhesive sheet for semiconductor device. |
