SUBSTRATE EMPLOYING A VENT HOLE ARRANGEMENT SUITABLE FOR ENCAPSULATING AN ELECTRICAL COMPONENT PACKAGE MOUNTED THEREON AND RELATED METHOD.

摘要

A substrate (110) employing a plurality of vent holes (212-214) is used to encapsulate an electrical component package (108) in a one-pass process. The vent holes (212-214) extend through the substrate (110) and are centrally positioned in an attachment site (201) thereof. The attachment site (201) includes a plurality of pads (202) that mate with corresponding contacts (304) carried on the component package (108). Once mated, an application of epoxy (112) completely around the component package (108) is made. Upon heating, the epoxy (112) flows into a gap (604) between the component package (108) and the substrate (110). The event holes (212-214) exhaust air from the gap (604) and allow the epoxy (112) to quickly and completely fill the gap (604), thereby encapsulating the component package (108).