| 摘要 |
FIELD: microelectronics, radio engineering, computer technology, and jewelry industry. SUBSTANCE: chemical gold plating solution comprises 0.5-1.0 g/l (in terms of gold), 8.0-21.0 g/l complexing agent and demineralized water. Solution further contains 15-25 g/l lower alcohol and/or 0.003- 0.015 g/l alkali metal or ammonium carbonate. EFFECT: preparation of thin, pore-free, dense, mechanically strong gold coating with decorative effect. 4 cl, 2 tbl:
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