| 摘要 |
<p>PROBLEM TO BE SOLVED: To facilitate the step of manufacturing a multilayer circuit board by eliminating the high precision adjustment of resistance values of all resistors for adjusting the resistance value ratio of a plurality of resistors. SOLUTION: Within a multilayer circuit board 10 formed by the thick-film printing method, after the formation of inner electrodes 12 and a resistor 13, an insulator layer 15 having via holes 14 is formed. Next, surface electrodes 16 and another resistor 17 are formed on the surface of the insulator layer 15. At this time, the inner electrodes 12 and the surface electrodes 16 are connected by the via holes 14. Next, the laser-trimming step 18 is performed for adjusting the resistance values of the resistor 17 provided on the surface of the insulating layer 15. As a result of this multilayer circuit board 10 in corporating the resistor 13 can be completed.</p> |
