PROCEDE ET DISPOSITIF DE CONNEXION D'UN COMPOSANT SEMICONDUCTEUR SUR UN SUBSTRAT EQUIPE DE CONDUCTEURS

摘要

The invention concerns a method for connecting a semiconductor component (1) provided with contacts (4) on a substrate (3) equipped with conductors (2). The contacts (4) of the semiconductor component (1) are electrically contacted with the conductors (2) and the electric contact is maintained by means of a binder (5) which is supported on one side by the substrate (3) and by the other on the component. The invention is useful in particular for connecting an integrated circuit on the flat glass a television tube.