| 摘要 |
PROBLEM TO BE SOLVED: To form an accurate via hole through photoimaging, using an alkaline aqueous solution by specifying the content of hydrolytic chlorine in a photosensitive additive adhesive composition. SOLUTION: A photosensitive additive adhesive composition comprises a multifunctional epoxy resin of 120-500 epoxy quantity equivalent, a phenol novolac having one or more acryloyl group or methacryloyl group, an epoxy acrylate or epoxymethacrylate compound, a diluent composed of a photopolymerization and thermally reactive monomer, a photopolymerization starting agent, and calcium carbonate. In order to impact superior insulation characteristic, it is required to reduce the content of hydrolytic chlorine in each component of the composition, and it is especially effective for reducing chlorine ion of calcium carbonate. Hydrolytic chlorine contained in calcium carbonate is thereby reduced below 100ppm by water washing set previously. |
