| 摘要 |
PROBLEM TO BE SOLVED: To set the utility efficiency of thermosetting molding resin to be satisfactory, by arranging a resin filling/pressurizing device in the arbitrary part of an electronic parts matrix lead frame, and filling/pressurizing thermoset ting molding resin melted in more than two cavities from the resin filling/ pressurizing device. SOLUTION: The pots P of the resin filling/pressurizing device are arranged on arbitrary places on the electronic parts matrix lead frame L having the products of more than two strings, which are loaded on an electronic parts molding die heated at a prescribed temperature, or below the electronic parts matrix lead frame L. Thermosetting resin melted in more than two cavities 2 is charged from the pots P. The multiple products can simultaneously be transfer resin-molded setting resin utility efficiency in the products against supplied resin is not more than 90%, and product cost can be reduced. |
