| 摘要 |
PROBLEM TO BE SOLVED: To reliably screen semiconductor wafers by providing a burn-in base unit having a high-flatness base, soft and reusable Z-axis unit and wafer level contact sheet laminated on the Z-axis unit. SOLUTION: A base unit 7, soft and selectively conductive Z-axis member 8, laminate type wafer level contact sheet 9, chuck 1 for receiving a semiconductor wafer 1 and test signal generator 10 are provided. The base unit 7 has a high-flatness structure and extends over one or more edges of the wafer 1. The wafer level contact sheet 9 may have substantially the same size as the wafer 1 and has contact pads 20 in a pattern corresponding to contact pads 3 on the wafer 1 and first terminals 13. The selectively conductive member 8 provides electric contact between the first terminal 13 of the base unit 7 and current pad 20 on the wafer level contact sheet 9. |
