发明名称 NON-CONTACT IC CARD
摘要 PROBLEM TO BE SOLVED: To prevent alternating and remodeling by laminating the surface of the central layer storing electronic parts and forming the surface layer with a surface layer material causing in-layer peeling owing to a stress equal to below a breaking strength at the time of peeling of the surface layer. SOLUTION: This card has a structure in which the surface layer is laminated on one side or both sides of the central layer storing the electronic parts. As a material of the surface layer, it is not particularly limited provided that it has a stress equal to below the breaking strength of the surface layer itself and causes the in-layer peeling when the surface layer is peeled from the central layer, but a material in which holes or minute voids are formed on the surface and the inside of a plastic film (e.g. synthetic paper) is used from various characteristics required in the card, such as durability, printability, strength, processability, adhesive property, heat resistance at the time of laminating, cost, etc. Thus, by using the resin material of which the surface layer breaks down within the layer in layers, the remodeling is prevented, and by using the resin material not including a halogen element, the generation of a halogenated hydrogen is avoided in incineration.
申请公布号 JPH10171962(A) 申请公布日期 1998.06.26
申请号 JP19960329480 申请日期 1996.12.10
申请人 MITSUBISHI CHEM CORP 发明人 MIYOSHI MOTOYUKI;SHINOHARA HIDEO
分类号 B42D15/10;G06K19/07;G06K19/077;G06K19/10 主分类号 B42D15/10
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