| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a thick film chip part in which no cracking or chipping is caused when dividing into thick film chip part units, and they are avoided even at mounting. SOLUTION: A functional film 6 deciding operation is formed on a center part of each unit area 2 divided with a plurality of dividing grooves 3 and 4 crossing at right angles in a ceramic substrate 5, and upper surface electrodes 7 connected to the functional film 6 are formed at edge parts of facing two sides of each unit area 2, and an insulating protective film 8 covering the functional film 6 is formed inside each unit area 2, and insulating/shutting films separated from the insulating protective film 8 are provided while bridging between adjoining unit areas 2. Here, the substrate is divided into band-shaped blocks 10, with the side on which the upper surface electrode 7 is formed as a cutting side, and a side part electrode 11 is formed extending from the edge part of the cutting side to an end surface while covering a part of each upper electrode 7 and integrated therewith, and then the band-shaped block 10 is cut with a thick film chip part as a unit.</p> |
