| 摘要 |
<p>PROBLEM TO BE SOLVED: To improve the terminal wiring structure of an IGBT power module, etc., so as to stabilize the quality and reliability of a terminal assembly insert molded in a resin case integrated with terminals. SOLUTION: The semiconductor device comprises a circuit block having metal base and power elements mounted thereon, a resin case integrated with terminals, and a case cover. Main circuit terminals and the terminals frame 5a of auxiliary terminals 5 are insert molded in the resin case 1. The auxiliary terminals 5 are concentrated and disposed at the case end, the terminal frame 5a thereof is laid along the case side wall, inner lead leg pieces 5b thereof are soldered to the circuit block. The terminal frame 5a is laid along the inner wall of the case and insert molded in a half buried form and the middle thereof is held with rib-like protrusions 1a of the case from inside. The terminal frame 5a has pin holes 5d and protrusions 5c having holes to support the terminal frame 5a at specified inserted position by insert pins of a die.</p> |
