| 摘要 |
<p>PROBLEM TO BE SOLVED: To hold a wafer, without contaminating it, by placing linear members for holding and releasing the wafer by closing and opening their top ends at the marginal edge of the wafer with specified spacings. SOLUTION: Before chucking a wafer 5, stainless steel wires 1 for holding the wafer extend obliquely upwards to the outside of the wafer 5 from a guide plate for guiding the wires 1 with their top ends spread to enclose the wafer 5 more than from the outside of the wafer. To chuck the wafer 5, the wires 1 are pulled down from the guide plate 2 and act so that their top ends contacted to a wafer chuck move toward the wafer center, thereby chucking the wafer 5 with the wires 1. Thus the wafer is held, without contaminating it.</p> |
