PLASTIC MOLDED TYPE SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To provide a semiconductor device capable of suppressing generation of crack, by suppressing generation of crack which is to be caused by vapor of water content absorbed in sealing resin or by stress due to difference of coefficient of thermal expansion. SOLUTION: A semiconductor chip 11 is bonded on a die pad 12 of a lead frame. Terminal parts of the semiconductor chip 11 are bonded and connected to inner leads 131 of a lead segment 13 by using wires 14. The semiconductor chip 11 is resin-sealed together with the die pad 12 by using sealing resin 15. In this case, a peeling part 16 having a width of 0.5mm or less from the outer periphery of the rear of the die pad 12 is artificially formed. This peeling part is formed by bonding, e.g. a polymer tape 17 whose adhesion to the resin is low.