发明名称 METHOD FOR CONNECTING METAL TERMINAL PLATE TO SUBSTRATE IN MOLDED ARTICLE, AND METHOD FOR FIXING ELECTRONIC PARTS AND THE SUBSTRATE IN THE MOLDED ARTICLE
摘要 PROBLEM TO BE SOLVED: To provide a method for connecting a metal terminal plate to a substrate in a molded article, which can be manufactured easily and inexpensively. SOLUTION: A conduction pattern of a flexible substrate 10 is joined directly to a metal terminal plate 39 of an electronic part 30. With this state, the flexible substrate 10 is supported to be pinched between an upper metal mold 71 and a lower metal mold 73. Pins 81 and 87 in cavities 75 and 77 generate a proper pinching force to hold a joint part between the metal terminal plate 39 and the conduction pattern of the flexible substrate 10. When molten molding resin is injected from a pin gate 89 at a high temperature under a high pressure, most of the molten molding resin is directly sprayed on the back face of a function part body 31 through a through hole 19, and the surface 33 of the function part body 31 is brought into pressure contact with an abutment face 79. Therefore, the molding resin does not intrude into the surface 33, while the joint part between the metal terminal plate 39 and the flexible substrate 10 are pressure contacted with upside and downside under the action of pressure of the molten mold resin. Thereafter, when the molten molding resin is solidified, the joint part can be firmly fixed mechanically and electrically.
申请公布号 JPH10172713(A) 申请公布日期 1998.06.26
申请号 JP19960354109 申请日期 1996.12.17
申请人 TEIKOKU TSUSHIN KOGYO CO LTD 发明人 INAGAKI JIRO;MIZUNO SHINJI;SHINOKI TAKASHI
分类号 H01R43/24;H01L21/56 主分类号 H01R43/24
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