| 摘要 |
PROBLEM TO BE SOLVED: To provide a packaging method that is low in cost and high in reliability. SOLUTION: A V-groove 14 and substrate side electrode pads 4 are respectively formed on an Si substrate 1 by a series of photolithography. A rectangular groove 15 is formed by machining, etc., in a direction perpendicular to the V-groove 14. Next, individual piece-like AuSn solder bumps 5 are thermally press bonded by punching onto the substrate side electrode pads 4. A semiconductor laser 10 is then placed on the AuSn solder bumps. When the laser is subjected to reflow joining in an N2 atmosphere where the surface oxidation of the solder hardly occurs, the laser is joined to the prescribed position with high accuracy by a self-alignment effect. Next, an optical fiber 16 is positioned by the V-groove 14 and is fixed by an adhesive, etc. As a result, the alignment of the optical axis 10a of the semiconductor laser 10 and the optical axis 16a of the optical fiber 16 is attained. |
