发明名称 METALLIC TERMINAL CONNECTION STRUCTURE TO CIRCUIT BOARD IN FORMED PRODUCT, AND ITS CONNECTING METHOD
摘要 PROBLEM TO BE SOLVED: To facilitate the manufacture, and to prevent defective connection between a conductive pattern and a metallic terminal plate by interposing an elastic conductive coating layer in a metallic terminal plate connection structure to a board in a formed product. SOLUTION: One end of a metallic terminal plate 20 is loaded on an elastic conductive coating layer 50 of a flexible board 10, and held by upper and lower dies. The high-temperature and high-pressure molten mold resin is force fed from a pin gate provided on one die. In an abutting part of the metallic terminal plate 20 and the elastic conductive coating layer 50, the elastic conductive coating layer 50 together with a film 11 is pressed against the metallic terminal plate 20 and closely attached. Because the same treatment is achieved on the opposite side, the elastic conductive coating 50 is surely connected to the metallic terminal plate 20. At the same time, the space between the elastic conductive coating 50 and the metallic terminal plate 20 is pressed from the upper and lower sides, and connected in an elastically-connected condition where the elastic conductive coating 50 is elastically deformed by the prescribed quantity.
申请公布号 JPH10172630(A) 申请公布日期 1998.06.26
申请号 JP19960354110 申请日期 1996.12.17
申请人 TEIKOKU TSUSHIN KOGYO CO LTD 发明人 INAGAKI JIRO;MIZUNO SHINJI;SHINOKI TAKASHI
分类号 H01C1/034;H01C10/00;H01R43/24;H05K3/24;H05K3/28;H05K3/32;(IPC1-7):H01R9/09 主分类号 H01C1/034
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