| 摘要 |
<p>PROBLEM TO BE SOLVED: To improve availability of an exposure apparatus by coping easily with a change of substrate thickness by an efficient operation, also by decreasing possibility of break of a projection lens, etc. SOLUTION: When a substrate WA such as a ceramic substrate, etc., is relative thick as shown in Fig. (A), the substrate WA is held directly by a substrate holder 50 without the need for an adaptor 70. However when a substrate WB is thin like a silicon wafer, etc., as shown in Fig. (B), the adaptor 70 held by the substrate holder 50, and the substrate WB is held by the adaptor 70. Thereby, in the both case, the projected optical image plane is flush with the substrate surface.</p> |
