| 摘要 |
<p>PROBLEM TO BE SOLVED: To obtain a semicoductor enclosure which can prevent a solder bonded part from being fractured even in a long-term heat history by a method wherein the thickness in the peripheral part of a wiring board is made substantially thin as compared with the thickness in the central part of the wiring board. SOLUTION: In a semiconductor enclosure 1, the peripheral part 4 of a ceramic wiring board 2 is made thinner than the central part 3. However, when the peripheral part is made too thin, the ceramic wiring board 2 is deformed too largely in the up-and-down direction, and the mounting reliability of the wiring board is lowered. It is desirable that the lower limit of the thickness of the peripheral part 4 is set at 0.1 or higher when the thickness of the central part is set at 1. In addition, it is desirable that the upper limit of the thickness of the peripheral part 4 is at 0.95 or lower when the thickness of the central part 3 is set at 1. When the peripheral part 4 of the ceramic wiring board 2 is made thinner than the central part 3, the stress concentration on a solder part is reduced. Thereby, a thermal cycle life is made long, the enclosure 1 is deformed very slightly in the up-and-down direction, the z-direction or the vertical direction with reference to a substrate face, a stress on the solder part in the x-direction and the y-direction is reduced, and the reliability of the enclosure is enhanced.</p> |
