| 摘要 |
PROBLEM TO BE SOLVED: To transfer a wafer after polishing to a containing position into a cassette without contaminating or breaking the wafer. SOLUTION: A robot arm 603 clamps the rear surface of a wafer after completion of polishing and cleaning from a temporal reception part 201 of a wafer transfer part 200 and places it on a pair of water flowing boards after inverting it 180 degrees. The pair of water flowing boards inclines downwards and water flows thereon. An assist pin 606 is moved together with the wafer 3 by a direct driving transfer device 607 and the wafer 3 is pushed into a cassette 4 by pushing the edge of the wafer 3. |
