Multi-layer lead frame for a semiconductor device

摘要

A multi-layer lead frame for a semiconductor device comprises a lead frame body made of a metal strip having a first opening and a plurality of inner leads (14) having respective inner tips which define the opening. A metal plane (10,12) independent from the lead frame body and adhered to the inner leads (14) by an insulating adhesive film (16), has an inner periphery defining a second opening corresponding to the first opening. The inner periphery of the insulation film protrudes slightly from the inner tips of the inner leads (14) to prevent short circuits between the metal layers.