发明名称 |
Semiconductor housing with structure containing conductor parts for integrated circuit mfr. |
摘要 |
The housing has the conductor parts (21) embedded in holes, extending at regular intervals through the structure (22). There is a fastener, on which are secured leads (23) extending in four directions, each serving for coupling to one conductor part. Preferably the fastener is a strip for securing the leads. Typically each contact part comprises a contact hump for electric coupling to the respective lead. The casing may be in the form of a block-shaped plate with holes for the conductor parts, with the structure containing apertures for mounting chips. |
申请公布号 |
DE19755675(A1) |
申请公布日期 |
1998.06.25 |
申请号 |
DE1997155675 |
申请日期 |
1997.12.15 |
申请人 |
LG SEMICON CO., LTD., CHEONGJU, KR |
发明人 |
SHIN, MYEONG-JIN, CHEONGJU, KR |
分类号 |
H01L23/28;H01L21/56;H01L23/12;H01L23/13;H01L23/31;H01L23/36;H01L23/433;H01L23/498;H01L25/065 |
主分类号 |
H01L23/28 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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