发明名称 Semiconductor housing with structure containing conductor parts for integrated circuit mfr.
摘要 The housing has the conductor parts (21) embedded in holes, extending at regular intervals through the structure (22). There is a fastener, on which are secured leads (23) extending in four directions, each serving for coupling to one conductor part. Preferably the fastener is a strip for securing the leads. Typically each contact part comprises a contact hump for electric coupling to the respective lead. The casing may be in the form of a block-shaped plate with holes for the conductor parts, with the structure containing apertures for mounting chips.
申请公布号 DE19755675(A1) 申请公布日期 1998.06.25
申请号 DE1997155675 申请日期 1997.12.15
申请人 LG SEMICON CO., LTD., CHEONGJU, KR 发明人 SHIN, MYEONG-JIN, CHEONGJU, KR
分类号 H01L23/28;H01L21/56;H01L23/12;H01L23/13;H01L23/31;H01L23/36;H01L23/433;H01L23/498;H01L25/065 主分类号 H01L23/28
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