| 摘要 |
1342832 Electric couplings SPERRY RAND CORP 19 April 1971 [2 Feb 1970] 20682/71 Heading H2E To interconnect circuit boards having conductor patterns and plated holes formed by conventional techniques, springs 26 held in longitudinal compression by a dip solder coating are inserted between the surfaces to be connected, within apertures defined by insulating sheets 24, the stack clamped, and heat applied to melt the solder so that the springs expand into firm contact with the conductive portions 22 &c. and are soldered thereto when the stack is cooled. The springs may be radially compressed, by twisting them on a mandrel before dip soldering, to effect a connection as shown in Fig. 2. |
