| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of manufacturing a chip part-type LED which is capable of coping enough with a size and thickness reduction in various apparatuses without deteriorating in reliability as a part. SOLUTION: A cathode-side metal film 1 and an anode-side metal film 2 are arranged separating from each other by a space L1 on the same plane, an insulating film 3 is provided by bridging the films 1 and 2 with space L1, and an LED chip 4 is arranged on the insulating film 3. The LED chip 4 is arranged lying on its side so as to make its cathode plane 4a and anode plane 4b located above the films 1 and 2 respectively, the cathode plane 4a and the anode plane 4b are connected to the cathode-side metal film 1 and the anode-side metal film 2 with conductive member 5 respectively, and the LED chip 4 and the conductive member 5 are sealed up with light transmitting resin 6. |
