发明名称 MANUFACTURE OF OPTICAL DEVICE-PACKAGED SUBSTRATE, AND OPTICAL MODULE
摘要 PROBLEM TO BE SOLVED: To make it possible to have alignment makers and/or electrodes to allow alignment with good accuracy so that the alignment of mounting grooves, such as V-grooves, for mounting optical waveguide bodies, such as optical fibers and optical waveguides, electrodes for mounting optical elements or the mounting grooves and the alignment markers for mounting the optical elements can be executed with the good accuracy. SOLUTION: The mounting groves 7 and the electrodes for mounting the optical elements and/or the alignment markers are formed by photolithography using a photomask having the mounting groove patterns for mounting the optical wavegudie bodies and the electrode patterns for mounting the optical elements and/or the alignment marker patterns which are the earmarks at the time of mounting the optical elements formed on a substrate 1. The optical module is formed by optically coupling the optical waveguide bodies and the optical elements on the optical device packaging substrate S.
申请公布号 JPH10170773(A) 申请公布日期 1998.06.26
申请号 JP19960334303 申请日期 1996.12.13
申请人 KYOCERA CORP 发明人 SAKUJIMA SHIROU;KYOMASU MIKIO
分类号 G02B6/30;G02B6/42;H01L31/0232;H01L33/48 主分类号 G02B6/30
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