| 摘要 |
PURPOSE:To obtain the above hot-melt fluoroplastic molded item, which does not stain product, by a method wherein thermoplastic fluoroplastic molded item is brought into contact with pure water having specified resistance value. CONSTITUTION:Hot-melt fluoroplastic molded item such as carrier for semiconductor wafer or the like is brought into contact with pure water having the resistance value of 10MOMEGA or higher. After the hot-melt fluoroplastic molded item is brought into contact with pure water, the resultant molded item is dried at 60-150 deg.C for 2-4 hours. The above-mentioned contact between the molded item and ultrapure water may well be performed not only once but also a plurality of times. Thus, fluorine ion(F<->), hydrogen ion(H<+>) or hydrogen fluoride in the molded item can be remarkably reduced. Further, no remarkable increase of fluorine ion, hydrogen ion or hydrogen fluoride occurs even after a longer time since the contacting treatment. |
