| 摘要 |
A lead frame (10) for a high component density semiconductor device includes fine pitched lead frame leads (20) that have a reduced thickness and tapered end (22) adjacent the die mount pad (12) of the lead frame. The reduced thickness end (22) has a step down (23) from the portion (25) of the lead frame lead that is not reduced in thickness. The reduced thickness end (22) is connected to bond pads on the semiconductor device either directly or by bond wires. <IMAGE> |
