| 摘要 |
A submount including: an insulating substrate having therein a throughhole filled with a sintered metal powder, and an electroconductive layer formed on each of the two opposing surfaces of the insulating substrate, wherein the sintered metal powder filled in the throughhole of the insulating substrate is formed, for example, by filling, in the throughhole, a metal paste composed mainly of copper, tungsten, molybdenum or the like and then conducting firing and wherein the two electroconductive layers are electrically connected with each other at least partially by the sintered metal powder. The submount according to the present invention has a low electric resistance and high reliability and can be made in a small size. Therefore, it can be suitably used as a novel submount for semiconductor laser element, which promises electrical conduction between a semiconductor laser element and a heat sink.
|
