| 摘要 |
PROBLEM TO BE SOLVED: To provide an IC card in which an IC module is not present on a surface of the card in a non-contact type IC card for holding the module and a method for easily manufacturing the card. SOLUTION: An opening for engaging an IC module 10 is formed at a plastic sheet as a center core 21, and the module 10 resin-molded is engaged within the opening. In the case of laminating oversheets 22, 23, liquid-like adhesive of gel-like resin composition is filled in a clearance formed between the opening of the core 21 and an outer periphery of the module 10 to fix the module to the core sheet. Thus, manufacture of the non-contact type IC card is facilitated. Further, the surface of the IC card can be formed in a smooth surface without influence of the module 10, and operating fault due to a bending deformation is reduced by improving a strength of the IC card. |
