发明名称 Method and apparatus for smoothing substrate surfaces
摘要 Smoothing surfaces of a substrate having a profile and irregular surfaces. According to one embodiment, a layer of fill material is applied to at least one surface of the substrate, wherein the fill material fills irregularities in the at least one surface. The layer of fill material is scraped from the at least one surface to provide a relatively smooth at least one surface.
申请公布号 US5770267(A) 申请公布日期 1998.06.23
申请号 US19960628503 申请日期 1996.04.05
申请人 J. M. HUBER CORPORATION 发明人 BULLOCK, JR., RALPH S.
分类号 B05D1/42;B05D5/00;(IPC1-7):B05D3/12;B05C11/04 主分类号 B05D1/42
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