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发明名称
EPOXY RESIN COMPOSITION FOR SEMICONDUCTOR SEALING
摘要
申请公布号
JPH10168162(A)
申请公布日期
1998.06.23
申请号
JP19960331809
申请日期
1996.12.12
申请人
SUMITOMO BAKELITE CO LTD
发明人
OTA MASARU
分类号
C08L63/00;C08G59/62;C08L83/04;(IPC1-7):C08G59/62
主分类号
C08L63/00
代理机构
代理人
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