| 摘要 |
PROBLEM TO BE SOLVED: To efficiently polish a wafer in a more productive manner. SOLUTION: A retainer ring 353 to hold a polishing cloth on a fixed board is provided around an attracting pad 351 to attract a wafer, and plural slits 355 are radially provided on the lower face of the annular portion of the retainer ring 353, so that polishing liquid can be supplied from the outside of the retainer ring 353 through the slits 355 to the inside face of the wafer. |
