| 摘要 |
PROBLEM TO BE SOLVED: To provide a carrier tape which can be easily and inexpensively manufactured in a simple form wherein a terminal or the like of a received electronic component may not be scratched during transportation or the like. SOLUTION: The carrier tape is formed with storage recesses 2 for receiving a semiconductor package 9 such as CSP at constant intervals in a lengthwise direction. In this case, a sticking layer of a closed-cell structure having numerous pores in a sponge type whose opening diameter is 1 to 150μm and an opening area ratio is 20 to 80% is formed of polyurethane elastomer with hardness (JIS K6253) of 1 to 50 on a bottom of the storage recess 2, so that a negative pressure occurring in pores of the sticking layer is used to stick and hold a solder ball 9b of the semiconductor package 9.
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